GEMINI CVD SYSTEM
Technology : PECVD(Plasma-Enhanced Chemical Vapor Deposition)
As device scales down, uniformity is important as it can affect wafer CD variation which leads to poor device fabrication. Since dielectric films are used to form insulating features in a semiconductor device, it requires films that are exceptionally smooth as it will affect subsequent layers.

GEMINI PECVD dielectric films are well-known for its extremely outstanding uniformity. Not only it has a superior productivity, but also it significantly reduces cost of ownership with very high- throughput.

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QUANTA SYSTEM
Technology : PECVD(Plasma-Enhanced Chemical Vapor Deposition)
3D NAND manufacturing process starts with depositing multiple alternating layers of materials such as Oxide and Nitride films. Each thin layer must be highly uniform, extremely smooth and with good adhesion to subsequent layers which can help increase the 3D NAND device density.

QUANTA SYSTEM provides process solution for Oxide, Nitride (ON) stack with management of film uniformity, stress, roughness and controllable WER. Our QUANTA system can provide solution for 3D NAND device fabrication for higher capacity and advanced performance.

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GEMINI ALD SYSTEM
Technology : PEALD(Plasma-Enhanced Atomic Layer Deposition )
As device nodes becomes more complex, lithography challenges arise as more steps adds up that brings up some limitations. GEMINI ALD-Oxide provides solution for these limitations with patterning spacers for DRAM and Logic devices.

The GEMINI ALD system is used for applications like Self-aligned Double Patterning (SADP) and Self-aligned Quadruple Pattern (SAQP), to provide solution for advanced lithography patterning steps.

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